Babarepairing Tools And Training Private Limited
Karol Bagh, New Delhi, Delhi
GST No. 07AAICB9913E1ZN
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We offer Rework Station, In order to meet the set quality standards, these are manufactured using the best grade raw material and sophisticated technology. Highly appreciated among clients for their sturdiness, easy operation, accuracy, low maintenance and durability, these are available in variegated specifications. The offered rework stations are tested on various parameters of quality in order to deliver flawless range at clients’ end. Our product range also comprises of Soldering Station and Power Supply.
Product Details:
| Minimum Order Quantity | 1 Piece |
| Packaging Type | Secure Box Packaging (Shock-Resistant Protective Case) |
| Product Type | NAND Reballing Platform / BGA Chip Alignment Tool |
| Usage/Application | Used for precise reballing, alignment, and soldering of NAND ICs including BGA315, BGA153/169, BGA11 |
| Material | High-quality Heat-Resistant Aluminum Alloy + Stainless Steel Components |
| Color | SILVER |
The JTX-N3 NAND Reballing Platform is a high-precision, professional-grade solution engineered for technicians, microsoldering specialists, and repair labs working with modern NAND memory packages. Designed to support BGA315, BGA153/169, BGA110, and similar NAND configurations, this platform provides unmatched accuracy, stability, and ease of use for even the most demanding reballing tasks.
Built from durable, heat-resistant materials, the JTX-N3 platform ensures a perfectly secure hold on delicate ICs during reballing, alignment, stencil application, and soldering workflows. Its refined mechanical structure eliminates the margin of error typically seen in lower-quality holders, enabling technicians to achieve factory-grade results with consistent ball placement and clean solder distribution.
The platform incorporates a precision alignment system that locks the NAND chip into the ideal position relative to the stencil, ensuring that every solder ball lands exactly where it should. This dramatically reduces rework, increases success rates for reballing, and enhances reliability in high-volume repair environments.
One of the core strengths of the JTX-N3 is its compatibility with universal and dedicated expansion stencils, making it suitable for a wide variety of mobile devices, game consoles, SSDs, and other electronics using BGA-based NAND memory. The modular design allows for quick stencil changes and efficient workflow transitions when working on multiple chip types.
The thermal-safe body of the platform helps distribute heat evenly during preheating and soldering, preventing chip deformation or warping. The sturdy base ensures the chip and stencil remain completely stable throughout the process, giving technicians full control while reducing the risk of bridging, shifting, or overheating.
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