Tempered Glass

Product Details:

The JTX SM01 iPhone 8 / 8 Plus IC Swap Board & Reballing Platform is a premium, precision-engineered solution designed for professional repair technicians who handle delicate micro-soldering and advanced board-level operations. Built with accuracy, durability, and workflow efficiency in mind, this blue-module platform provides a stable and reliable foundation for IC reballing, chip alignment, and motherboard component transfers.

This tool is ideal for technicians who regularly perform IC swapping, reballing, removing and reinstalling CPU/PMIC/baseband chips, or conducting high-precision logic board repairs on the iPhone 8 and iPhone 8 Plus. Its robust construction ensures that chips stay firmly in place, allowing you to work with confidence even when dealing with the smallest solder points.

Crafted from high-quality, heat-resistant materials, the JTX SM01 platform withstands repeated exposure to hot air and high temperatures without warping or losing structural integrity. The aluminum alloy body offers exceptional heat dissipation, keeping components stable and minimizing the risk of thermal damage during reballing or chip installation. The blue module features precision-cut contours that match the exact dimensions of the iPhone 8/8P chip layout, ensuring proper seating and alignment every time.

The included high-accuracy reballing stencil adds another level of efficiency to your repairs. Designed with uniform holes and laser-cut precision, it ensures consistent solder ball placement, enabling flawless reballing with minimal effort. The stencil securely fits onto the module, preventing sliding or misalignment during hot-air reflow.

Additional Information:

• Production Capacity: 100
• Delivery Time: 6 TO 7 WORKING DAYS
• Packaging Details: CUSTOM PACKAGING

Product Details:

The Luowei LW-AP06 Tempered Insulating Glass Two-Axis Motherboard Repair Fixture is a highly specialized, precision-engineered tool designed to support professional-level repair, reballing, bonding, alignment, and inspection of delicate electronic motherboards. Whether used in mobile device repair labs, micro-soldering environments, or manufacturing and testing facilities, this fixture is built to deliver exceptional stability, heat resistance, and operational accuracy. As modern repair work increasingly demands fine detail, controlled mechanical movement, and materials that can withstand intense thermal cycles, the LW-AP06 stands out as a dependable solution for technicians seeking both performance and durability.

At the core of the LW-AP06 is its tempered insulating glass platform, engineered to withstand high temperatures common in motherboard repair—especially during hot-air reflow, IC removal, BGA rework, and thermal calibration procedures. Unlike conventional metal fixtures that can transfer heat unevenly or warp under prolonged exposure, the tempered glass surface maintains structural integrity, ensuring that the board stays perfectly flat throughout the repair process. This thermal stability helps reduce the risk of board flexing, solder joint cracking, or component displacement, thereby improving repair success rates.

The fixture’s defining feature is its dual-axis (X-Y) mechanical adjustment system, which provides controlled multidirectional movement. Precision-milled rails and smooth-glide bearings offer micro-adjustments that allow technicians to align components, center chips, position FPC connectors, or target specific repair zones with exceptional accuracy. The ability to fine-tune the board’s position without physically touching or lifting it minimizes handling risk, making it ideal for working with fragile multilayer PCBs, thin mobile logic boards, and heat-sensitive chipsets.

Complementing this alignment system are the secure clamping arms, engineered to hold the motherboard firmly in place without introducing pressure points. These clamps are typically made from heat-resistant alloys or reinforced polymer composites, which prevent accidental heat conduction to sensitive areas. Their adjustable range allows compatibility with various board sizes—from small mobile device PCBs to medium-sized motherboard segments used in tablets and smart gadgets. Smooth tightening knobs give technicians confidence that the board will not shift under hot air or mechanical stress.

Ergonomics and workflow optimization play a significant role in the LW-AP06's design. The fixture often includes 360-degree visibility, allowing easy access to all corners and layers of the board. The open-frame structure ensures compatibility with microscopes, magnifiers, and auxiliary lighting systems. Technicians can comfortably work underneath, above, or beside the board without obstruction. The platform’s elevated design also improves air circulation, enhancing heat dissipation and preventing hot spots.

One of the standout attributes of this fixture is its compatibility with modern micro-soldering techniques. The tempered glass surface resists chemical corrosion from flux, alcohol, and cleaning agents commonly used during board preparation. Its smooth, non-porous finish makes residue removal effortless, maintaining a clean and professional workspace. Additionally, the fixture’s weight-balanced construction prevents accidental tipping or sliding, even when performing high-pressure tasks like IC scraping, solder wick cleaning, or stenciling.

Additional Information:

• Production Capacity: 1000
• Delivery Time: 6 to 7 working days